MiJing Z15 BGA Reballing Fixture for iPhone 11
 

1. Install the iPhone 11 main board on the platform.
2. Cover the iPhone 11 BGA reballing stencil on the mainboard.
3. Evenly spread tin on the cover of the reballing stencil.
4. Remove the reballing stencil cover.
5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.

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Packing 
Original package + carton box

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