Motherboard Disassemble Platform Heating Groove For iPhone 11/11 PRO/11 PRO MAX  - T12A - N11




Description

The motherboard disassembles platform heating groove For iPhone 11/11 PRO/11 PRO MAX - T12A -N11 is suitable For iPhone 11/11 PRO/11 PRO MAX Mas motherboard

repair heating disassembly, CPU, and other components heating degumming. It is matched with the Motherboard Disassemble Platform Main Unit - SS-T12A.

Note:

This item is just including the iPhone 11/11 PRO/11 PRO MAX motherboard heating groove, not including the heating station's main unit.

Specifications

● Model: T12A -N11

● Motherboard heating groove size: 126*72*18mm (L*W*H)

● Temperature: 100-280℃

Compatibility

For iPhone 11/11 PRO/11 PRO MAX

Features

● The motherboard disassembles the platform heating groove including the heating area For iPhone 11/11 PRO/11 PRO MAX, CPU glue removal area.

● The motherboard disassembles the platform heating groove iPhone 11/11 PRO/11 PRO MAX is only heating the middle column, without heating the CPU.

● Silicone insulation, high-temperature resistance, lowering the temperature of the bottom contact surface.

● High-purify copper is used as the contact surface to ensure uniform heat transfer and heat.

Packing

Original package + carton box

After-sale service

Please feel free to contact us for any problems at any time: service@fanscreate.com