RELIFE 10CC Solder Paste Flux No-clean Green Oil Original Soldering Paste RL-403 Solder Tin Sn63/Pb67 for Soldering Iron Tips

Syringe 10CC RL-403 High-quality Solder Paste Flux, RELIFE RL-403 Soldering Paste Tin Sn63/Pb67 20-38um For Phone motherboard BGA soldering repair. Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding

Syringe 10CC RL-403 Solder Paste Flux 183℃ no-clean Phone Repair soldering

 

Specification:

Name: RELIFE RL-403 183℃ solder paste (syringe)
Specifications: 10cc
Alloy: Sn63/Pb67
Microns: 20-38um

Feature:

1.Good adhesion. Paste delicate, particles small, only 20~38 microns.
2.Excellent wettability. After opening, the surface remains moist for 36 hours. Does not affect the welding.
3.Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
 
Application:
 Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive.

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Packing

Anti-shock solid package suitable for transportation

After-sale service

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