SS -T12A Motherboard Disassemble Platform Main Unit For Mobile Phone 

Description

The motherboard disassembles the platform main unit for mobile phone - SS-T12A is a double layers board pre-heating rework station, it is used for quick desolder&resolder for mobile phone double-layer logic board.

Note

This item is just including the mobile phone - SS - T12A heating station main unit, not including the motherboard heating groove.

Specifications

● Model: SS-T12A

● Main machine size: 124*90*40mm (L*W*H)

● Input: AC110-230V, 50/60Hz, 5A

● Net weight: 375 g

● Rated Power: 70W

● Temperature: 100-280℃

Compatibility

For mobile phone

Features

● Accurate temperature control and temperature adjustable

● Offers heat evenly to protect the motherboard from damage

● Adopting 185 degrees layered process to remove the mobile phone's motherboard.

solder paste, but it depends on the special heating design and precise temperature control of SS-T12A.

● SS-T12A motherboard separate platform only heats the area that the mobile phone's board needs to be removed to prevent improper heating.

● Dual bayonet design, make sure the mobile phone's motherboard is stable on the stage.

● High purity copper is used as a film to ensure uniform heat transfer and heat.


After-sale service   
Please feel free to contact us for any problems at any time: service@fanscreate.com